This inventor holds 5 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1982-1998.
Company Filing History:
Years Active: 1982-1998
Title: The Innovations of Robert A. Magee
Introduction
Robert A. Magee is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of electronic components, holding a total of 5 patents. His work primarily focuses on high-density electronic components, showcasing his expertise and innovative spirit.
Latest Patents
Magee's latest patents include the "High I/O Density MLC Flat Pack Electronic Component." This invention features a flat pack electronic component with input/output pads that are electronically connected to an outside device. It comprises a multilayer ceramic substrate with multiple individual electrical conductors, a chip secured to the substrate, and a variety of input/output pads located at the periphery of the substrate. These pads are electrically connected to the chip through the individual electrical conductors. Another significant patent is the "Method of Making High Input/Output Density MLC Flat Pack." This patent describes a high-density I/O flat pack electronic component that includes a multilayer ceramic substrate with internal electrical conductors, which connect I/O pads on the component's periphery to a chip.
Career Highlights
Robert A. Magee has had a distinguished career at International Business Machines Corporation (IBM). His work at IBM has allowed him to develop and refine his innovative ideas, contributing to the advancement of electronic component technology. His patents reflect his commitment to enhancing the efficiency and functionality of electronic devices.
Collaborations
Throughout his career, Magee has collaborated with notable colleagues, including Lawrence P. Remsen and Edward H. Faulkner. These collaborations have likely enriched his work and contributed to the successful development of his patents.
Conclusion
Robert A. Magee's contributions to the field of electronic components are significant and impactful. His innovative patents demonstrate his expertise and commitment to advancing technology in this area. His work continues to influence the development of high-density electronic components, showcasing the importance of innovation in the tech industry.