The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 1997
Filed:
Oct. 10, 1995
Applicant:
Inventor:
Robert Arthur Magee, Poughkeepsie, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29830 ; 79852 ; 156 89 ; 257724 ; 264 61 ; 361772 ;
Abstract
A high density I/O flat pack electronic component is provided comprising a multilayer ceramic substrate having internal electrical conductors for electrically connecting I/O pads on the periphery of the component to a chip on the electronic component.
Magee, Robert. (1997). Method of making high input/output density mlc flat pack (U.S. Patent No. 5669136). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5669136
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile