Rie Takada

Title: Rie Takada: Innovator in Semiconductor and Electrical Connector Technologies

Introduction

Rie Takada is a prominent inventor based in Kawasaki, Japan. She has made significant contributions to the fields of semiconductor devices and electrical connector technologies. With a total of 6 patents to her name, her work has had a substantial impact on the industry.

Latest Patents

One of her latest patents is a heat sink device and method of repairing semiconductor devices. This innovative method involves turning a press member to apply pressure on an electronic component mounted on a substrate. The heat sink, which is provided on the electronic component via a bonding layer, is displaced in a transverse direction. The bonding layer is sheared with the press member to remove the heat sink from the electronic component. Another notable patent is for an electrical connector assembly. This invention is designed to achieve a high-precision fit starting with fairly rough positioning. The assembly consists of a first connector equipped with multiple substrates secured in an array and a second connector with female terminals that mates with the first connector. The electrical connector features a rough guide mechanism for initial mating and a precision guide mechanism for advanced mating.

Career Highlights

Throughout her career, Rie Takada has worked with notable companies such as Fujitsu Corporation and Tyco Electronics. Her experience in these organizations has allowed her to develop and refine her innovative ideas.

Collaborations

Rie has collaborated with esteemed colleagues, including Hiroyuki Otaguro and Masao Hosogai. These partnerships have contributed to her success and the advancement of her inventions.

Conclusion

Rie Takada's contributions to semiconductor and electrical connector technologies highlight her innovative spirit and dedication to her field. Her patents reflect her expertise and commitment to advancing technology.