The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Jul. 18, 2011
Applicants:

Tsuyoshi Yamamoto, Kawasaki, JP;

Naoaki Nakamura, Kawasaki, JP;

Rie Takada, Kawasaki, JP;

Kenichiro Tsubone, Kawasaki, JP;

Yasuhide Kuroda, Kawasaki, JP;

Harumi Yagi, Kawasaki, JP;

Inventors:

Tsuyoshi Yamamoto, Kawasaki, JP;

Naoaki Nakamura, Kawasaki, JP;

Rie Takada, Kawasaki, JP;

Kenichiro Tsubone, Kawasaki, JP;

Yasuhide Kuroda, Kawasaki, JP;

Harumi Yagi, Kawasaki, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01T 23/00 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); Y10T 29/49721 (2015.01);
Abstract

A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.


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