This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Fujitsu Corporation. Active years: 1987-2015.
Location History:
- Yokohama, JP (1987)
- Kawasaki, JP (2000 - 2015)
Company Filing History:
Years Active: 1987-2015
Title: Harumi Yagi: Innovator in Semiconductor Technology
Introduction
Harumi Yagi is a prominent inventor based in Kawasaki, Japan. She has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. Her innovative work focuses on improving the efficiency and reliability of electronic components.
Latest Patents
One of her latest patents is a heat sink device and method of repairing semiconductor devices. This method involves turning a press member to apply pressure on an electronic component mounted on a substrate. The heat sink, which is provided on the electronic component via a bonding layer, is displaced in a transverse direction. The bonding layer is sheared with the press member to remove the heat sink from the electronic component. Another notable patent is related to the method of forming solder bumps and preformed solder. This method includes multiple cycles of printing solder paste on a board using a mask with openings and heating the solder paste to fuse it, thereby forming solder bumps.
Career Highlights
Harumi Yagi has established herself as a key figure in her field through her innovative patents and contributions to semiconductor technology. Her work has been instrumental in advancing the methods used in electronic component manufacturing.
Collaborations
She has collaborated with notable coworkers, including Tsuyoshi Yamamoto and Noritsugu Ozaki, further enhancing her contributions to the industry.
Conclusion
Harumi Yagi's innovative work in semiconductor technology and her patents reflect her dedication to advancing electronic component manufacturing. Her contributions continue to influence the field significantly.