The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2000
Filed:
May. 15, 1998
Applicant:
Inventors:
Harumi Yagi, Kawasaki, JP;
Noritsugu Ozaki, Kawasaki, JP;
Tsuyoshi Yamamoto, Kawasaki, JP;
Toshiyuki Nakada, Kawasaki, JP;
Takeshi Komiyama, Kawasaki, JP;
Yoshihito Okuwaki, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; H05K / ;
U.S. Cl.
CPC ...
22818022 ; 22818022 ; 228254 ; 2282481 ; 29840 ; 437183 ;
Abstract
A method of forming solder bumps on pads provided on a board, wherein a plurality of solder bump layer forming cycles are repeatedly implemented. Each of the solder bump layer forming cycles includes the steps of printing solder paste on the board using a mask having mask openings and heating the solder paste so as to fuse the solder paste for forming solder bumps.
Yagi, Harumi. (2000). Method of forming solder bumps and method of forming preformed solder (U.S. Patent No. 6109507). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6109507
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile