Fujitsu Corporation

Tyco Electronics Amp K.k.

Rie Takada

Hiroyuki Otaguro

Hitoshi Yokemura

Takayuki Ashida

Masao Hosogai

Setuo Kojima

Toshio Abe

Kenichiro Tsubone

Tsuyoshi Yamamoto

Takeshi Kimura

Naoaki Nakamura

Mitsunori Abe

Kazuya Orui

Yasuhide Kuroda

Harumi Yagi

Hidehiro Mishiro

Kunihiko Shimizu

A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Heat sink device and method of repairing semiconductor device

The present invention relates to an electrical connector assembly capable of achieving a high-precision fit starting with fairly rough positioning, the assembly consisting of a first connector which is equipped with multiple substrates secured in an array and a second connector which is equipped with female terminals and mates with the first connector. The electrical connector has a rough guide mechanism (first guides and second guides as well as first complementary guides and second complementary guides) which guides a mating between the first connector and the second connector relatively roughly at an initial stage of mating, and a precision guide mechanism (chamfers on substrates and corresponding tapers on a housing of the second connector) which guides the mating between the first connector and the second connector relatively precisely at an advanced stage of mating.

Electrical connector assembly

A method for fabricating a matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board is formed to include a board made of an insulating material, first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other, and through holes provided at cross points of the first and second wiring patterns. A connection pin inserted into at least one of the through holes, electrically connects at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side.

Method for fabricating a matrix switchboard and connection pin

A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.

Matrix switch board used to connect/disconnect switching system-and

A laminate capacitor circuit board which permits constants of various kinds of circuit elements to be set by selectively effected connections between wiring layers, and a laminate capacitor circuit board which permits distributed circuit constants in a high-frequency wiring layer sandwiched between two shielding wiring layers to be set as desired. These circuits are formed with at least a pattern of a conductive foil on each dielectric layer, and include a plurality of wiring layers laminated one upon another, a wiring layer for connections laminated to a surface of the plurality of wiring layers laminated one upon another, a plurality of terminal patterns formed on the wiring layer for connections in a state insulated from each other, a plurality of vias for electrically connecting at least two of the plurality of terminal patterns to corresponding ones of the plurality of wiring layers, and connecting means for selectively connecting the plurality of terminal patterns to each other.

Laminate circuit board with selectable connections between wiring layers

Matrix switch board, connection pin, and method of fabricating them

Growing community of inventors

Kawasaki, Japan

Rie Takada