Company Filing History:
Years Active: 1992-2000
Title: Richard William Malek: Innovator in Organic Electronics
Introduction
Richard William Malek is a prominent inventor based in Johnson City, NY (US). He has made significant contributions to the field of organic electronics, holding a total of 6 patents. His innovative work focuses on the fabrication of electronic packages with organic substrates, showcasing his expertise in this cutting-edge technology.
Latest Patents
One of Malek's latest patents is titled "Organic electronic package and method of applying palladium-tin seed." This patent describes a method for fabricating an electronic package that utilizes an organic substrate made of fiberglass and epoxy. The process involves depositing an organic polyelectrolyte onto the substrate, followed by the application of a colloidal palladium-tin seed layer. A photoimageable polymer is then deposited and photolithographically patterned to reveal portions of the seed layer. The uncovered areas are catalytic for the electroless deposition of copper, resulting in a conductive layer atop the seed layer. The organic polyelectrolyte is deposited from an aqueous solution at a pH suitable for the desired seed catalyst coating, depending on the specific polyelectrolyte used.
Career Highlights
Richard William Malek is currently employed at International Business Machines Corporation (IBM), where he continues to push the boundaries of innovation in electronic packaging. His work has been instrumental in advancing the capabilities of organic electronics, making significant strides in the industry.
Collaborations
Malek has collaborated with notable colleagues, including Voya Rista Markovich and Ashwinkumar C Bhatt. These partnerships have contributed to the development of groundbreaking technologies in the field.
Conclusion
Richard William Malek is a distinguished inventor whose work in organic electronics has led to several patents and advancements in the industry. His innovative methods and collaborations continue to shape the future of electronic packaging.