The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 1998
Filed:
Dec. 01, 1995
Anilkumar Chinuprasad Bhatt, Johnson City, NY (US);
Ashwinkumar Chinuprasad Bhatt, Endicott, NY (US);
Robert Jeffrey Day, Dryden, NY (US);
Thomas Patrick Duffy, Endicott, NY (US);
Jeffrey Alan Knight, Endwell, NY (US);
Richard William Malek, Johnson City, NY (US);
Voya Rista Markovich, Endwell, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A process for making a circuitized substrate is defined wherein the substrate is treated with two different, e.g., additive and subtractive, metallization processes. The process is thus able to effectively produce substrates including conductive features, e.g., high density circuit lines and chip heat-sinking pads, of two different degrees of resolution in a cost effective and expeditious manner. The resulting product is also defined.