The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 1995

Filed:

Dec. 23, 1993
Applicant:
Inventors:

Roy H Magnuson, Endicott, NY (US);

Richard W Malek, Johnson City, NY (US);

Voya R Markovich, Endwell, NY (US);

William E Wilson, Waverly, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F / ;
U.S. Cl.
CPC ...
430314 ; 430313 ; 430318 ; 430327 ;
Abstract

A process for selective plating of a metal onto a substrate surface is provided. The process includes laminating a layer of conductive metal onto a dielectric substrate; and providing thru holes extending through said layer of conductive metal and said dielectric substrate. A thin layer of conductive metal is plated on the walls of the thru holes; and a photoresist layer is applied to the surface of the conductive metal and selectively exposed and developed to provide a mask corresponding to the negative of the desired circuit pattern. The exposed metal that is not covered by the photoresist is removed and then the remaining photoresist is removed to thereby provide the desired circuit pattern. A conductive metal is plated on the pattern up to the desired thickness.


Find Patent Forward Citations

Loading…