Richard W Gurtler

Title: Richard W. Gurtler: Innovator in Semiconductor Technologies

Introduction

Richard W. Gurtler, an accomplished inventor based in Mesa, AZ, has made significant contributions to the field of semiconductor technology with a total of 15 patents to his name. His innovations focus on enhancing the electrical and mechanical interconnections between semiconductor devices, showcasing his expertise in this cutting-edge domain.

Latest Patents

One of Richard's latest patents is titled "Method of Shaping Inter-Substrate Plug and Receptacles Interconnects." This invention details a method for electrically and mechanically interconnecting two high-density semiconductor devices. The design includes plug members connected to circuit elements of the first semiconductor device and receptacle members linked to the second semiconductor device, facilitating seamless connections and disconnections.

Another notable patent from Richard is the "Method of Forming Vias Through Two-Sided Substrate." This innovation focuses on creating an integrated circuit substrate with active circuit elements on both surfaces, interconnected by through-substrate vias. This methodology minimizes signal routing and reduces propagation delay, optimizing the performance of integrated circuits.

Career Highlights

Richard W. Gurtler works at Motorola Corporation, a prominent player in the telecommunications and semiconductor industries. His work has not only advanced the capabilities of semiconductor technology but has also reinforced Motorola's reputation as an innovator in the field.

Collaborations

Throughout his career, Richard has collaborated with talented individuals such as Israel A. Lesk and Ralph J. Ellis, contributing to the development of groundbreaking semiconductor technologies. These collaborations have enriched the innovative environment in which he operates, leading to the birth of several key technologies in the industry.

Conclusion

Richard W. Gurtler has established himself as a visionary in semiconductor innovations. His patented methods for interconnecting semiconductor devices are redefining standards in the industry. As he continues to innovate at Motorola Corporation, his work promises to influence the future of electronics and integrated circuit design.