Richard S Wagner

Title: Richard S. Wagner: Innovator in Integrated Circuit Fabrication

Introduction

Richard S. Wagner is a notable inventor based in Bernardsville, NJ (US), recognized for his contributions to the field of integrated circuit fabrication. With a total of 4 patents, Wagner has made significant advancements that have influenced the technology industry.

Latest Patents

Wagner's latest patents include a process for fabricating integrated circuits with shallow junctions. This innovative method allows for direct contact to shallow junctions in integrated circuits by utilizing a specific aluminum chemical vapor deposition (CVD) process. In this process, aluminum is deposited using a triisobutyl aluminum precursor onto a substrate that has a nucleation layer, such as a titanium nitride layer. The careful selection of this nucleation layer helps control the nucleation of the depositing aluminum, ensuring suitable contact while avoiding void defects that can occur without such a layer.

Another significant patent involves a fabrication technique for producing magnetic bubble devices with planar geometry. This technique consists of a sequence of processing steps that includes the sequential deposition of an insulating material, an electrically conductive material, a second insulating material, and a material like permalloy on a garnet substrate. The uppermost layer is patterned using conventional techniques, and this pattern serves as a mask for removing the exposed underlying insulating layer. The exposed metal conducting layer is then patterned and etched in a different design from that of the permalloy and second insulating layers, using selective plasma etching that minimally degrades the dielectric material or the permalloy. The result is a device with layers that exhibit planar geometry.

Career Highlights

Throughout his career, Richard S. Wagner has worked with prestigious organizations such as Bell Telephone Laboratories and AT&T Bell Laboratories. His work in these institutions has contributed to the advancement of telecommunications and integrated circuit technologies.

Collaborations

Wagner has collaborated with notable colleagues, including Hyman J. Levinstein and Frank B. Alexander, Jr. Their combined expertise has furthered the development of innovative technologies in their respective fields.

Conclusion

Richard S. Wagner's contributions to integrated circuit fabrication and magnetic bubble devices highlight his role as a significant innovator in the technology sector. His patents and collaborations reflect a commitment to advancing the field, making him a noteworthy figure in the world of inventions.