Company Filing History:
Years Active: 2013-2016
Title: Richard Raymond Green: Innovator in Electronic Component Packaging
Introduction
Richard Raymond Green is a notable inventor based in Durham, NC (US). He has made significant contributions to the field of electronic component packaging, holding a total of 3 patents. His work focuses on innovative methods and structures that enhance the reliability and efficiency of electronic components.
Latest Patents
Richard's latest patents include an "Electronic component package fabrication method and structure." This invention describes an electronic component structure that features a primary redistribution structure with a terminal. A secondary redistribution structure is formed on this terminal, and a buildup dielectric layer encloses the primary redistribution structure. The design incorporates a cushion pad that supports the secondary redistribution structure, allowing stress from an interconnection ball to be effectively dissipated, thereby minimizing the risk of failure. Another patent, titled "Electronic component package fabrication method," outlines a method for forming a first buildup dielectric layer on a wafer containing electronic components. This method ensures the complete removal of the second buildup dielectric layer above the singulation streets, enhancing the overall manufacturing process.
Career Highlights
Richard is currently employed at Amkor Technology, Inc., where he continues to innovate in the field of electronic packaging. His expertise and contributions have positioned him as a key figure in the industry.
Collaborations
Richard has collaborated with several talented individuals, including Sundeep Nand Nangalia and Robert Lanzone. These partnerships have further enriched his work and contributed to the advancement of electronic component technologies.
Conclusion
Richard Raymond Green is a distinguished inventor whose work in electronic component packaging has led to significant advancements in the field. His innovative patents and collaborations reflect his commitment to enhancing the reliability of electronic components.