The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Dec. 15, 2011
Sundeep Nand Nangalia, Raleigh, NC (US);
Richard Raymond Green, Durham, NC (US);
Robert Lanzone, Chandler, AZ (US);
Ravi Kiran Chilukuri, Cary, NC (US);
Rex Beach Anderson, Iii, Raleigh, NC (US);
Sundeep Nand Nangalia, Raleigh, NC (US);
Richard Raymond Green, Durham, NC (US);
Robert Lanzone, Chandler, AZ (US);
Ravi Kiran Chilukuri, Cary, NC (US);
Rex Beach Anderson, III, Raleigh, NC (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
An electronic component package includes a RDL pattern comprising a redistribution pattern terminal. A buildup dielectric layer is formed on the RDL pattern, the buildup dielectric layer having a redistribution pattern terminal aperture exposing the redistribution pattern terminal. An interconnection ball is formed within the redistribution pattern terminal aperture and on the redistribution pattern terminal. The interconnection ball includes an enclosed portion having an outer concave surface within the buildup dielectric layer. The angle of intersection between the outer concave surface of the interconnection ball and the redistribution pattern is less than 90°. This minimizes stress between the interconnection ball and the redistribution pattern which, in turn, minimizes failure of the bond between the interconnection ball and the redistribution pattern.