Richard Knipper

Title: Richard Knipper: Innovator in Semiconductor Technology

Introduction

Richard Knipper is a notable inventor based in Wuppertal, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods for fabricating semiconductor devices and packages.

Latest Patents

One of Richard's latest patents is titled "Semiconductor device and method for fabricating the same." This patent describes a method that involves providing a semiconductor die and arranging an electrical connector over it. The electrical connector includes a conductive core, an absorbing feature, and a solder layer. The method allows for soldering the electrical connector onto the semiconductor die using a laser, which heats the solder layer by irradiating the absorbing feature.

Another significant patent is "Method for fabricating a semiconductor package, semiconductor package and embedded PCB module." This patent outlines a process that begins with a semiconductor wafer and involves several steps, including masking sawing lines, depositing a first metal layer, and encapsulating semiconductor dies. The innovative techniques described in these patents enhance the efficiency and effectiveness of semiconductor manufacturing.

Career Highlights

Richard Knipper is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role at Infineon has allowed him to further develop his expertise and contribute to cutting-edge technologies in the semiconductor industry.

Collaborations

Richard has collaborated with notable colleagues, including Thorsten Scharf and Alexander Heinrich. Their teamwork has fostered an environment of innovation and creativity, leading to advancements in semiconductor technology.

Conclusion

Richard Knipper's contributions to semiconductor technology through his patents and work at Infineon Technologies AG highlight his role as a key innovator in the field. His methods for fabricating semiconductor devices and packages are paving the way for future advancements in technology.