Phoenix, AZ, United States of America

Richard Chen

USPTO Granted Patents = 7 

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 90(Granted Patents)


Company Filing History:


Years Active: 1983-2024

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7 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Richard Chen

Introduction

Richard Chen is a prominent inventor based in Phoenix, AZ, recognized for his significant contributions to electronics packaging. With a total of seven patents to his name, Chen has demonstrated a continuous commitment to innovation in the field of electronic component packaging.

Latest Patents

One of Chen’s latest advancements is the invention of a shielded electronic component package. This innovative electronic component package consists of a substrate with an electronic component mounted on it, featuring a bond pad. A first antenna terminal is electrically connected to the bond pad and further linked to a second antenna terminal located on the substrate. Enclosed in a protective package body, the antenna is formed on the principal surface through the application of an electrically conductive coating. This process simplifies production, ultimately minimizing overall manufacturing costs while reducing the package's size due to the thin design of the antenna.

Career Highlights

Chen has had a notable career, having worked with leading companies in the industry. He has gained invaluable experience at Amkor Technology, Inc., and Amkor Technology Singapore Holding Pte. Ltd. His work at these companies has significantly influenced his development as an inventor and innovator.

Collaborations

Throughout his career, Richard Chen has collaborated with talented professionals, including Jong Ok Chun and Nozad Karim. Their collective expertise has likely contributed to the successful realization of various projects and innovations in the field of electronics.

Conclusion

In summary, Richard Chen's journey as an inventor illustrates the intersection of creativity and practicality in technology. His latest patents and collaborative efforts highlight the ongoing evolution of electronic component packaging, paving the way for future innovations in the field. Chen's work exemplifies the importance of continuous improvement and innovation, reinforcing his position as a key figure in electronics development.

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