Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

National Patent Development Co.

Amkor Technology Singapore Pte. Ltd.

Richard Chen

Michael G Kelly

Nozad Karim

Jong Ok Chun

Giuseppe Selli

An electronic component package includes a substrate and an electronic component mounted to the substrate, the electronic component including a bond pad. A first antenna terminal is electrically connected to the bond pad, the first antenna terminal being electrically connected to a second antenna terminal of the substrate. A package body encloses the electronic component, the package body having a principal surface. An antenna is formed on the principal surface by applying an electrically conductive coating. An embedded interconnect extends through the package body between the substrate and the principal surface and electrically connects the second antenna terminal to the antenna. Applying an electrically conductive coating to form the antenna is relatively simple thus minimizing the overall package manufacturing cost. Further, the antenna is relatively thin thus minimizing the overall package size.

Shielded electronic component package

Shield lid interconnect package and method

Top feature package and method

A hydrophilic soft contact lens is made from a cross-linked copolymer of an N,N-(C.sub.1 -C.sub.2 alkyl)acrylamide and cyclohexyl methacrylate. The lens has much higher oxygen permeability and better mechanical properties than conventional hydrophilic contact lenses.

Permeable contact lens

Growing community of inventors

Phoenix, AZ, United States of America

Richard Chen