Hillsboro, OR, United States of America

Richard C Schaefer

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard C Schaefer. Retrieved from https://idiyas.com/inventor/richard-c-schaefer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Richard C Schaefer: Innovator in Gas Venting Technology

Introduction

Richard C Schaefer is an accomplished inventor based in Hillsboro, OR (US). He has made significant contributions to the field of electronics through his innovative patent related to gas venting components. His work has implications for improving solder joints in surface mount circuit boards.

Latest Patents

Richard holds a patent for a gas venting component mounting pad. This invention allows for the escape of gases from the junction between an electrical component and its associated mounting pad during the soldering process. The venting mechanism can be achieved through one or more through holes in the board or by solder-free channels formed in the pad. This innovation facilitates a more complete and effective solder joint between the component base and pad.

Career Highlights

Richard is currently employed at Intel Corporation, where he continues to contribute to advancements in technology. His expertise in gas venting technology has positioned him as a valuable asset within the company.

Collaborations

Richard has collaborated with notable coworkers, including Andrew J Balk and John G Oldendorf. Their combined efforts have fostered an environment of innovation and creativity at Intel Corporation.

Conclusion

Richard C Schaefer's contributions to gas venting technology exemplify the importance of innovation in the electronics industry. His patent not only enhances the quality of solder joints but also reflects his commitment to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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