The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 2010

Filed:

Mar. 30, 2007
Applicants:

Richard C. Schaefer, Hillsboro, OR (US);

Steven Pollock, Hillsboro, OR (US);

Charles M. Bailley, Beaverton, OR (US);

Mike Lowe, Aloha, OR (US);

Andrew J. Balk, Beaverton, OR (US);

John G. Oldendorf, Portland, OR (US);

Inventors:

Richard C. Schaefer, Hillsboro, OR (US);

Steven Pollock, Hillsboro, OR (US);

Charles M. Bailley, Beaverton, OR (US);

Mike Lowe, Aloha, OR (US);

Andrew J. Balk, Beaverton, OR (US);

John G. Oldendorf, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.


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