Aloha, OR, United States of America

Mike Lowe


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovations of Inventor Mike Lowe

Introduction

Mike Lowe, an inventive mind based in Aloha, Oregon, has made a significant contribution to the world of electronic engineering with his innovative patent. With a strong focus on enhancing the functionality of surface mount circuit boards, his work addresses common issues faced during the soldering process, proving essential in the realm of electronic component assembly.

Latest Patents

Mike Lowe holds one notable patent: the "Gas Venting Component Mounting Pad." This invention introduces a solution for venting gases that form at the junction between an electrical component and its mounting pad during soldering. By incorporating either through holes or solder-free channels, this design allows gases to escape efficiently, promoting a more effective solder joint. This advancement is crucial in ensuring the reliability and performance of electronic devices.

Career Highlights

Mike Lowe is currently affiliated with Intel Corporation, a leading name in technological innovation and microprocessor manufacturing. His work at Intel has allowed him to explore various engineering challenges and develop solutions that enhance product functionality. Over the years, his contributions have aligned with the company’s mission to push the boundaries of what technology can achieve.

Collaborations

In his pursuit of innovation, Mike Lowe has collaborated with esteemed colleagues Richard C. Schaefer and Steven L. Pollock. This collaborative environment fosters creativity and enables the exploration of new ideas, ultimately leading to successful patents and advancements in technology.

Conclusion

Mike Lowe exemplifies the spirit of innovation that drives the technology industry forward. His inventive solutions, particularly through his gas venting component mounting pad patent, showcase his commitment to improving electronic components and systems. As he continues his journey at Intel Corporation, the impact of his work will likely resonate throughout the engineering community and beyond.

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