Location History:
- Fair Oaks, CA (US) (1994 - 1996)
- Shingle Springs, CA (US) (2002 - 2003)
- El Dorado Hills, CA (US) (2002 - 2009)
Company Filing History:
Years Active: 1994-2009
Title: The Innovative Contributions of Richard B. Foehringer
Introduction
Richard B. Foehringer is a notable inventor based in El Dorado Hills, CA. He has made significant contributions to the field of technology, particularly in the area of circuit board packaging. With a total of 9 patents to his name, Foehringer's work has had a considerable impact on the industry.
Latest Patents
Among his latest patents, Foehringer has developed a "Packaging method for circuit board." This method involves populating a circuit board with components and encapsulating it with a material. The process further includes separating the circuit board into multiple devices. Another notable patent is the "Lower profile package with power supply in package." This innovation features a Power Supply In Package (PSIP) that utilizes a charge pump external to the die, allowing for a smaller die size. The die is mounted on a substrate with an array of solder balls, maintaining a size comparable to packages without PSIP capability.
Career Highlights
Foehringer is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his innovative designs and methods. His work at Intel has positioned him as a key player in the advancement of electronic packaging solutions.
Collaborations
Throughout his career, Foehringer has collaborated with esteemed colleagues such as Suresh V. Golwalkar and Michael Wentling. These collaborations have further enhanced the quality and impact of his inventions.
Conclusion
Richard B. Foehringer's contributions to the field of technology through his patents and work at Intel Corporation highlight his role as a significant inventor. His innovative approaches to circuit board packaging continue to influence the industry and pave the way for future advancements.