The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
Jan. 02, 2002
Applicant:
Inventors:
Eleanor P. Rabadam, Folsom, CA (US);
Richard B. Foehringer, El Dorado Hills, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/358 ;
U.S. Cl.
CPC ...
H01L 2/358 ;
Abstract
A package with a Power Supply In Package (PSIP) feature may include a charge pump external to the die in order to take advantage of a smaller die size. The die may be mounted on a substrate with an array of solder balls of a Ball Grid Array. The package may have substantially the same size as a package without PSIP capability. In one embodiment, the passive components may be mounted on the die using epoxy. In another embodiment, the reduced-size passive components may be mounted on the substrate of the ball grid array in a region free of solder balls.