Eleanor P Rabadam

Title: Eleanor P Rabadam: Innovator in Power Supply Packaging

Introduction

Eleanor P Rabadam is a notable inventor based in Folsom, CA (US). She has made significant contributions to the field of packaging technology, particularly in the integration of power supplies within packages. Her innovative approach has led to advancements that benefit various electronic applications.

Latest Patents

Eleanor holds a patent for a "Lower profile package with power supply in package." This invention features a Power Supply In Package (PSIP) design that includes a charge pump external to the die, allowing for a smaller die size. The die is mounted on a substrate with an array of solder balls in a Ball Grid Array configuration. Notably, the package maintains a size comparable to that of a package without PSIP capability. In one embodiment, passive components are mounted on the die using epoxy, while in another, reduced-size passive components are placed on the substrate in regions free of solder balls. This patent showcases her innovative thinking and technical expertise.

Career Highlights

Eleanor is currently employed at Intel Corporation, where she continues to push the boundaries of technology. Her work at Intel has allowed her to collaborate with some of the brightest minds in the industry, contributing to the company's reputation for innovation.

Collaborations

Eleanor has worked alongside Richard B Foehringer, further enhancing her contributions to the field. Their collaboration exemplifies the importance of teamwork in driving technological advancements.

Conclusion

Eleanor P Rabadam is a pioneering inventor whose work in power supply packaging has made a significant impact on the electronics industry. Her innovative patent and career at Intel Corporation highlight her dedication to advancing technology.