Novato, CA, United States of America

Richard Anthony Gaona

This inventor holds 1 USPTO granted patent. Top assignee: Corning Incorporated. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard Anthony Gaona. Retrieved from https://idiyas.com/inventor/richard-anthony-gaona

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Richard Anthony Gaona: Innovator in Substrate Cutting Technologies

Introduction

Richard Anthony Gaona is a notable inventor based in Novato, CA (US). He has made significant contributions to the field of substrate cutting and separating systems. His innovative methods utilize advanced laser technology to enhance the precision of substrate manipulation.

Latest Patents

Richard holds a patent for "Substrate cutting and separating systems and methods." This patent describes a method of forming a plurality of defects within a substrate using a laser beam focal line. Each defect is a damage track within the substrate with a diameter of about 10 microns or less. The method involves exerting forces on both surfaces of the substrate to break it along a contour line, resulting in two distinct substrate portions.

Career Highlights

Richard is currently employed at Corning Incorporated, where he applies his expertise in substrate technologies. His work focuses on developing innovative solutions that improve manufacturing processes and product quality.

Collaborations

Richard has collaborated with talented individuals such as Andreas Simon Gaab and Nicolai Martin Haenel. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Richard Anthony Gaona is a pioneering inventor whose work in substrate cutting technologies has the potential to revolutionize manufacturing processes. His contributions continue to shape the future of this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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