This inventor holds 1 USPTO granted patent. Top assignee: Corning Incorporated. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Richard Anthony Gaona: Innovator in Substrate Cutting Technologies
Introduction
Richard Anthony Gaona is a notable inventor based in Novato, CA (US). He has made significant contributions to the field of substrate cutting and separating systems. His innovative methods utilize advanced laser technology to enhance the precision of substrate manipulation.
Latest Patents
Richard holds a patent for "Substrate cutting and separating systems and methods." This patent describes a method of forming a plurality of defects within a substrate using a laser beam focal line. Each defect is a damage track within the substrate with a diameter of about 10 microns or less. The method involves exerting forces on both surfaces of the substrate to break it along a contour line, resulting in two distinct substrate portions.
Career Highlights
Richard is currently employed at Corning Incorporated, where he applies his expertise in substrate technologies. His work focuses on developing innovative solutions that improve manufacturing processes and product quality.
Collaborations
Richard has collaborated with talented individuals such as Andreas Simon Gaab and Nicolai Martin Haenel. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Richard Anthony Gaona is a pioneering inventor whose work in substrate cutting technologies has the potential to revolutionize manufacturing processes. His contributions continue to shape the future of this field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
