The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Dec. 17, 2021
Corning Incorporated, Corning, NY (US);
Andreas Simon Gaab, Grobenzell, DE;
Richard Anthony Gaona, Novato, CA (US);
Nicolai Martin Haenel, Bayern, DE;
Dale Humphrey, Santa Rosa, CA (US);
Ralf Joachim Terbrueggen, Bavaria, DE;
John Eric Tyler, Napa, CA (US);
Corning Incorporated, Corning, NY (US);
Abstract
A method of forming a plurality of defects within a substrate with a laser beam focal line using a laser beam, each defect of the plurality of defects being a damage track within the substrate with a diameter of about 10 microns or less, the plurality of defects forming a contour line on the substrate. The substrate having a first surface and a second surface that is opposite from the first surface. The method further includes exerting (i) a first force on the first surface of the substrate at a location that is adjacent to the contour line and (ii) a second force on the second surface of the substrate at a location that is on the contour line. Additionally, the method includes breaking the substrate along the contour line and into a first substrate portion and a second substrate portion.