Santa Rosa, CA, United States of America

Dale Humphrey

This inventor holds 1 USPTO granted patent. Top assignee: Corning Incorporated. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dale Humphrey. Retrieved from https://idiyas.com/inventor/dale-humphrey

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Dale Humphrey: Innovator in Substrate Cutting Technologies

Introduction

Dale Humphrey is a notable inventor based in Santa Rosa, CA (US). She has made significant contributions to the field of substrate cutting technologies. With a focus on precision and efficiency, her work has implications for various industries that utilize substrate materials.

Latest Patents

Dale Humphrey holds a patent for "Substrate cutting and separating systems and methods." This innovative method involves forming a plurality of defects within a substrate using a laser beam focal line. Each defect is a damage track within the substrate with a diameter of about 10 microns or less. The method creates a contour line on the substrate, which has a first surface and a second surface opposite the first. The process includes exerting forces on both surfaces of the substrate to break it along the contour line, resulting in two separate portions.

Career Highlights

Dale is currently employed at Corning Incorporated, where she continues to develop and refine her innovative techniques. Her work at Corning has positioned her as a key player in advancing substrate cutting technologies.

Collaborations

Dale has collaborated with several talented individuals, including Andreas Simon Gaab and Richard Anthony Gaona. These partnerships have fostered a creative environment that enhances innovation and problem-solving.

Conclusion

Dale Humphrey's contributions to substrate cutting technologies exemplify her commitment to innovation and excellence. Her patent and work at Corning Incorporated highlight her role as a leading inventor in her field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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