John Eric Tyler

Title: Innovations by John Eric Tyler in Substrate Cutting Technologies

Introduction

John Eric Tyler is an accomplished inventor based in Napa, California. He has made significant contributions to the field of substrate cutting and separating systems. His innovative methods utilize advanced laser technology to enhance the precision and efficiency of substrate processing.

Latest Patents

John Eric Tyler holds a patent for a method of forming a plurality of defects within a substrate using a laser beam. This method involves creating damage tracks within the substrate, each with a diameter of about 10 microns or less. The defects form a contour line on the substrate, which has a first surface and a second surface opposite the first. The process includes applying forces on both surfaces to break the substrate along the contour line, resulting in two distinct portions.

Career Highlights

John Eric Tyler is currently employed at Corning Incorporated, a leading company in materials science and glass manufacturing. His work focuses on developing innovative solutions that improve substrate cutting techniques. With a patent portfolio that includes his recent invention, Tyler continues to push the boundaries of technology in his field.

Collaborations

Throughout his career, John has collaborated with notable colleagues, including Andreas Simon Gaab and Richard Anthony Gaona. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

John Eric Tyler's contributions to substrate cutting technologies exemplify the spirit of innovation. His patented methods not only enhance efficiency but also pave the way for future advancements in the industry.