Richard Allen Day

Title: Richard Allen Day: Innovator in Circuitized Substrate Technology

Introduction

Richard Allen Day is a notable inventor based in Whitney Point, NY (US). He holds a total of 16 patents that showcase his contributions to the field of circuitized substrate technology. His innovative approaches have significantly impacted the design and manufacturing of printed wiring boards.

Latest Patents

Among his latest patents, Day has developed a method for creating a circuitized substrate assembly. This method involves using two thin layers of permanent photoimaged solder mask material, which are applied through fine mesh screens. This technique ensures effective coverage and precise exposure of desired surfaces in high-density circuit patterns. Additionally, he has patented a process for selectively roughening conductors on high-frequency printed wiring boards. This innovation allows for smooth circuit lines in areas critical for signal propagation while enhancing adhesion in non-critical areas.

Career Highlights

Throughout his career, Richard Allen Day has worked with prominent companies such as IBM and Endicott Interconnect Technologies, Inc. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in circuit technology.

Collaborations

Day has collaborated with notable individuals in the industry, including David John Russell and Donald Herman Glatzel. These partnerships have fostered innovation and the exchange of ideas in the field of circuitized substrates.

Conclusion

Richard Allen Day's contributions to circuitized substrate technology and his impressive portfolio of patents highlight his role as a leading inventor in this field. His work continues to influence the development of advanced electronic systems.