Richard A Koepke

Title: Innovations by Richard A. Koepke

Introduction

Richard A. Koepke is an accomplished inventor based in New Bedford, MA (US). He holds a total of 4 patents that showcase his contributions to the field of microcircuit technology and fabrication methods. His innovative designs have significantly impacted the efficiency and functionality of electronic components.

Latest Patents

One of his latest patents is titled "Multi-path feed-thru lead and method for formation thereof." This invention provides increased conductive pathway density, particularly useful in microcircuit packages that house hybrid and semiconductor discrete and integrated circuit chips. The design includes an insulative substrate with a geometric configuration that facilitates sealing in microcircuit package apertures, enhancing conductive path density. The method of forming this lead involves metalizing the external surface of the substrate and selectively removing portions to create discrete conductive pathways.

Another notable patent is the "Method for fabricating a fold-up frame." This method allows for the easy and cost-effective creation of fold-up frames for flat packs that house discrete and integrated circuit chips. The process begins with cutting flat metallic stock to specific dimensions, followed by milling to create grooves that define sidewall members. The frames are then sliced, and apertures are formed, allowing for the final configuration to be achieved through folding and securing the frame.

Career Highlights

Richard A. Koepke is associated with Isotronics, Inc., where he has made significant contributions to the development of innovative electronic packaging solutions. His work has been instrumental in advancing the technology used in microcircuit assemblies.

Collaborations

Throughout his career, Richard has collaborated with notable colleagues, including John E. Ahearn and Raymond A. Frates. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Richard A. Koepke's inventive spirit and dedication to advancing technology have led to significant innovations in the field of microcircuit packaging. His patents reflect a commitment to improving the efficiency and effectiveness of electronic components, making him a notable figure in the industry.