The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 1991
Filed:
Dec. 28, 1989
Richard A Koepke, New Bedford, MA (US);
Isotronics, Inc., New Bedford, MA (US);
Abstract
A multi-path feed-thru lead is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips. The multi-path feed-thru leads have a configuration that facilitates sealing thereof in the apertures of microcircuit packages to provide increased conductive path density. The multi-path feed-thru lead according to the present invention includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry, respectively. A plurality of discrete metalized conductive pathways are formed on the intermediate portion ad first and second end portions of the insulative substrate. In one preferred method of forming the multi-path feed-thru lead of the present invention, the external surface of the insulative substrate is first metalized and then selected portions of metalization are removed to form the plurality of discrete conductive pathways. The multi-path feed-thru lead of the present invention thereby provides multiple conductive pathways on a single substrate member.