Method for fabricating a fold-up frame

Abstract

A method is disclosed for easy and inexpensive fabrication of fold-up frames having diverse geometric configurations for flat packs (metal packages) for housing discrete and integrated circuit chips. The method includes a first step of cutting a piece of flat metallic stock to predetermined length and width consistent with the number of fold-up frames and the perimeter required for the specific fold-up frame configuration to be fabricated, respectively. The flat stock is then milled to form a plurality of grooves of predetermined angle lengthwise in at least one major surface thereof to define the number of sidewall members in the final configuration of the fold-up frame. The milled flat stock may then be sliced to form a plurality of individual milled frames each having the predetermined height required by the specific configuration fold-up frame. Apertures are formed in the milled frame by punching or piercing all sidewall members simultaneously in a single operation. In a variation of the above-described method, the apertures are simultaneously punched in the milled flat stock prior to slicing thereof. The apertured, milled frame is then folded along the respective grooves to form the final specific configuration of the fold-up frame. The free ends of the milled frame in abutting engagement are secured together to fix the fold-up frame in the final specific configuration.