Ric DeHoff

Title: Ric DeHoff: Innovator in Wafer Mapping Technology

Introduction

Ric DeHoff is a notable inventor based in Hillsboro, OR (US), recognized for his contributions to wafer mapping technology. With a total of 2 patents, he has made significant advancements in the field, particularly in the design and functionality of wafer mapping systems.

Latest Patents

DeHoff's latest patents include the "Wafer Carrier Mapping Sensor Assembly" and the "System for Mapping Wafers Using Predictive Dynamic Lighting." The wafer mapping sensor assembly features a housing that contains an imaging array, with imaging optics designed to focus an image onto the array. An illumination source directs light toward the wafer, which is then reflected back, while an optical element minimizes undesirable illumination effects. The predictive dynamic lighting system incorporates an imaging array, a lighting module, and a controller that adjusts illumination based on initial wafer images to enhance subsequent image acquisition.

Career Highlights

Throughout his career, Ric DeHoff has worked with prominent companies such as Cyberoptics Corporation and Cyberoptics Semiconductor, Inc. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the semiconductor industry.

Collaborations

DeHoff has collaborated with notable individuals in his field, including Samuel J. Cole and Edward D. Seeberger, Jr. These partnerships have further enriched his work and expanded the impact of his inventions.

Conclusion

Ric DeHoff's innovative work in wafer mapping technology has established him as a key figure in the industry. His patents reflect a commitment to enhancing the efficiency and effectiveness of wafer mapping systems.