Unterfohring, Germany

Reinhold Buchner


Average Co-Inventor Count = 2.1

ph-index = 5

Forward Citations = 772(Granted Patents)


Location History:

  • Unterfohring, DE (1994 - 1999)
  • Unterfoehring, DE (2001 - 2003)

Company Filing History:


Years Active: 1994-2003

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6 patents (USPTO):

Title: Reinhold Buchner: Innovator in Semiconductor Technology

Introduction

Reinhold Buchner is a notable inventor based in Unterfohring, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of six patents. His work focuses on methods that enhance the functionality and security of semiconductor components.

Latest Patents

One of Buchner's latest patents is a method for producing three-dimensional circuits. This innovative approach involves providing two substrates, each containing tested components. The second substrate is diced into individual chips, which are then arranged and connected to the first substrate. This process results in a complete three-dimensional structure that enhances circuit capabilities. Another significant patent involves a method for wiring semiconductor components to prevent product piracy and manipulation. This method fabricates a metallized circuit structure that complicates reverse engineering, thereby protecting the technology and data stored within the semiconductor components.

Career Highlights

Throughout his career, Buchner has worked with esteemed organizations, including the Fraunhofer Gesellschaft zur Förderung der Angewandten Forschung e.V. His experience in these institutions has allowed him to develop and refine his innovative methods in semiconductor technology.

Collaborations

Buchner has collaborated with notable colleagues such as Peter Ramm and Karl Haberger. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Reinhold Buchner's contributions to semiconductor technology through his innovative patents demonstrate his commitment to enhancing the field. His work not only addresses current challenges but also paves the way for future advancements in technology.

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