Method for wiring semi-conductor components in order to prevent product piracy and manipulation, semi-conductors component made according to this method and use of said semi-conductor component in a chip card

Abstract

The invention relates to a method of fabricating a metallized circuit structure for preventing product piracy and product manipulation, a semiconductor component fabricated by the method as well as the use of the semiconductor component in a chip card. The method may be practiced with CMOS-compatible standard Semiconductor technologies and complicates the use of so-called reverse engineering for appropriating foreign technology knowhow or for reading and/or manipulating data stored in the component. It is also possible by the method in accordance with the invention to fabricate a semiconductor component protected from ambient influences. In the method in accordance with the invention the component layer in the substrate (,) is processed up to a metallization complex. Thereafter, the front surface of the component substrate (,) thus obtained is connected to the front surface of a handling substrate (,) and the component substrate (,) is thinned from the rear side. Thereafter, following an appropriate lithographic step, via holes (,) are etched and metallized through the remaining thin component substrate layer down to the areas to be contacted so that electrical contacts to the component are produced.