The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1998
Filed:
Sep. 22, 1995
Peter Ramm, Pfaffenhofen, DE;
Reinhold Buchner, Unterfohring, DE;
Abstract
A method of making a vertical integrated circuit by providing first and second substrates surfaces of which have layers with circuit structures and metallization planes therein, by providing an etching mask on a primary surface of the first substrate, forming via holes in the first substrate extending through the masking surface and the layers of the first substrate, reducing the thickness of the first substrate from a surface opposite its layer surface, alignedly connecting the first substrate by its reduced surface to the layer surface of the second substrate, subsequent deepening of the via holes to the metallization plane of the second substrate and forming electrical interconnection between the metallization planes in the first and second substrates through the via holes.