Reid E Berry

Title: The Innovative Contributions of Reid E. Berry

Introduction

Reid E. Berry is a notable inventor based in Ben Lomond, California. He has made significant contributions to the field of adhesive technologies, holding a total of 4 patents. His work focuses on innovative methods for adhering parts together, showcasing his expertise and creativity in engineering.

Latest Patents

One of Reid E. Berry's latest patents involves "Adhesive height setting." This patent describes methods for adhering parts together using part gap spacers. These spacers are formed in a selected pattern and height on the surfaces of two parts that are to be oppositely disposed. When positioned opposite each other, some of the part gap spacers contact the opposite surface, establishing a generally uniform standoff distance and creating voids. Adhesive is then disposed in these voids to adhere the part surfaces together. The methods also include forming part gap spacers on multiple sides of a third part to be placed between the two surfaces. The part gap spacers can take various shapes, including bumps, tapers, ribs, and flange edges.

Career Highlights

Reid E. Berry is currently employed at Seagate Technology Incorporated, where he continues to innovate and develop new technologies. His work at Seagate has allowed him to apply his inventive skills in a practical setting, contributing to advancements in the technology sector.

Collaborations

Throughout his career, Reid has collaborated with talented individuals such as Paco Gregor Flores and Anthony Joseph Aiello. These collaborations have likely enriched his work and led to further innovations in adhesive technologies.

Conclusion

Reid E. Berry's contributions to adhesive technologies demonstrate his commitment to innovation and engineering excellence. His patents reflect a deep understanding of materials and their applications, making him a valuable asset in the field.