Seagate Technology Incorporated

Reid E Berry

Anthony Joseph Aiello

Paco Gregor Flores

Klaus Dieter Kloeppel

Hans L Leuthold

Klaus Diete Kloeppel

Steve G Gonzalez

Ananda V Mysore

Methods for adhering parts together using part gap spacers are provided herein. Part gap spacers are formed in a selected pattern and a selected height on a surface of at least one surface of two parts to be oppositely disposed. When disposed opposite each other, at least some of the part gap spacers contact the opposite surface, and establish a standoff distance that is generally uniform, and thereby creating voids. Adhesive is disposed in at least some of the voids to adhere the part surfaces to each other. Further methods comprise forming part gap spacers on multiple sides of a third part to be disposed intermediate two surfaces. The part gap spacers can be formed in a variety of shapes, including bumps, tapers, ribs, and flange edges.

Adhesive height setting

A metrology system for measuring a cone angle, a cone straightness, and a cone quality of a sample and method of using the metrology system are disclosed. The system includes a rotary stage, one or more workpiece fixtures that hold the samples in the rotary stage, and a number of different sized measurement devices. The measuring devices are positioned next to the rotary stage and measure the samples using contact. The rotary stage is free to rotate when the measuring devices are in a non-measuring state. The invention also includes a processor that collects data from the measurement devices and calculates the cone angle, the cone straightness, and the cone quality of each sample based on the data.

Sleeve cone quality measurement system and method

Part gap spacers that are disposed between parts in a fluid dynamic bearing motor or hard disk assembly are provided herein. Part gap spacers are designed to off-set adjacent parts such that part-to-part spacing has less variation in tolerance accumulation. Part gap spacers also allow for greater control of bond line thickness of adhesives, and control of gap distances for bearing fluids, and allows for electrical conductivity across bonded parts.

Formed parts for adhesive height setting

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Ben Lomond, CA, United States of America

Reid E Berry