Raymond Jao

Title: Innovations of Raymond Jao

Introduction

Raymond Jao is a notable inventor based in Miaoli Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to solving complex engineering challenges.

Latest Patents

One of his latest patents is a fine pitch wafer bumping process. This process involves providing a wafer with a plurality of contact pads exposed by a passivation layer. An under bump metal (UBM) is formed on each contact pad, followed by the formation of a first mask film with openings that expose the UBM. A first solder material is filled into these openings and reflowed into solder posts. Subsequently, a second mask film is formed, and a second solder material is filled and reflowed to create bumps.

Another significant patent is for a semiconductor package that features a lead frame with an exposed base pad. This package includes a die pad for mounting a semiconductor chip, surrounded by leads for electrical connections. The design includes an opening to reduce the attaching area between the chip and die pad, preventing delamination. The base pad serves as a heat dissipater, effectively transferring heat from the semiconductor package to the surrounding environment.

Career Highlights

Raymond Jao is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to innovate in semiconductor packaging technologies. His work has contributed to advancements in the efficiency and reliability of semiconductor devices.

Collaborations

Raymond has collaborated with talented coworkers such as Chion-Ping Huang and Cheng-Yuan Lai, enhancing the innovative capabilities of their team.

Conclusion

Raymond Jao's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence in engineering. His work continues to influence the industry and pave the way for future advancements.