The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2000
Filed:
Aug. 25, 1999
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A semiconductor package includes a lead frame having a die pad for a semiconductor chip to be mounted thereon. The die pad is surrounded by a plurality of leads for electrically connecting the semiconductor chip and has one opening formed to decrease the attaching area between the semiconductor chip and the die pad so as to prevent the occurrence of declamination. A base pad is provided to be coupled to the die pad in such a manner that the base pad is positioned underneath or above the die pad and has a bottom surface or a top surface to be exposed to the extension of a resin encapsulant for enclosing the semiconductor chip and a portion of the lead frame, allowing the base pad to serve as a heat dissipater for transferring heat of the semiconductor package to the ambient.