Company Filing History:
Years Active: 2000
Title: The Innovations of Chion-Ping Huang
Introduction
Chion-Ping Huang is a notable inventor based in Hsinchu Hien, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package design.
Latest Patents
Chion-Ping Huang holds a patent for a semiconductor package that features a lead frame with an exposed base pad. This design includes a die pad for mounting a semiconductor chip, surrounded by leads for electrical connections. The innovative structure aims to reduce the attaching area between the semiconductor chip and the die pad, thereby preventing delamination. Additionally, the base pad serves as a heat dissipater, effectively transferring heat from the semiconductor package to the surrounding environment.
Career Highlights
Chion-Ping Huang is associated with Siliconware Precision Industries Co., Ltd., where he has been instrumental in advancing semiconductor packaging technologies. His expertise and innovative mindset have contributed to the company's reputation in the industry.
Collaborations
Chion-Ping Huang has worked alongside talented colleagues such as Cheng-Yuan Lai and Raymond Jao. Their collaborative efforts have further enhanced the development of cutting-edge semiconductor solutions.
Conclusion
Chion-Ping Huang's contributions to semiconductor technology exemplify the spirit of innovation. His patent for a semiconductor package with an exposed base pad showcases his commitment to improving product performance and reliability. His work continues to influence the semiconductor industry positively.