Company Filing History:
Years Active: 2009-2013
Title: The Innovative Contributions of Raul Mancera
Introduction
Raul Mancera is a notable inventor based in Chandler, AZ, who has made significant contributions to the field of multi-chip packaging technology. With a total of 4 patents to his name, Mancera's work focuses on advanced methods that enhance the efficiency and performance of electronic assemblies.
Latest Patents
Mancera's latest patents include innovative methods for making multi-chip packaging using an interposer. One embodiment of his work involves forming a plurality of vias partially through a body, with sidewalls defined by the body. An electrically insulating layer is formed on these sidewalls and on the upper surface of the body. An electrically conductive layer is then created on the insulating layer, defining first metal pads on the upper surface and second metal pads in contact with the first, with the second pads having a denser pitch than the first. This method allows for improved integration of electronic components.
Another significant patent describes the formation of electronic assemblies using a silicon-based interposer with through-silicon-vias. This process includes providing a body, forming a first metal pad layer, and creating a second metal pad layer in contact with the first. A dielectric layer is formed between the metal pads, and vias extending through the body expose the first metal pad layer. An insulating layer is formed on the via sidewalls, followed by an electrically conductive layer that is coupled to a substrate. These innovations are crucial for advancing multi-chip packaging technologies.
Career Highlights
Raul Mancera is currently employed at Intel Corporation, where he continues to push the boundaries of technology in the semiconductor industry. His work has been instrumental in developing methods that enhance the performance and reliability of electronic devices.
Collaborations
Mancera has collaborated with esteemed colleagues such as Sriram Muthukumar and Yoshihiro Tomita, contributing to a dynamic environment of innovation and creativity within Intel Corporation.
Conclusion
Raul Mancera's contributions to the field of multi-chip packaging are noteworthy and reflect his commitment to advancing technology. His innovative patents and collaborative efforts at Intel Corporation position him as a key figure in the electronics industry.