The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Nov. 29, 2010
Sriram Muthukumar, Chandler, AZ (US);
Raul Mancera, Chandler, AZ (US);
Yoshihiro Tomita, Ibaraki, JP;
Chi-won Hwang, Ibaraki, JP;
Sriram Muthukumar, Chandler, AZ (US);
Raul Mancera, Chandler, AZ (US);
Yoshihiro Tomita, Ibaraki, JP;
Chi-won Hwang, Ibaraki, JP;
Intel Corporation, Santa Clara, CA (US);
Abstract
In one embodiment, a method includes forming a plurality of vias partially through a body, the vias including sidewalls defined by the body. An electrically insulating layer is formed on the sidewalls and on an upper surface of the body. An electrically conductive layer is formed on the insulating layer in the vias and on the upper surface, the electrically conductive layer defining first metal pads on the upper surface and second metal pads in contact with the first metal pads, the second metal pads having a denser pitch than the first metal pads. A dielectric layer is formed between adjacent first metal pads and between adjacent second metal pads. The body is thinned through a lower surface and the electrically insulating layer in the vias is exposed. After the thinning, a portion of the electrically insulating layer in the, vias is removed. The body is coupled to a substrate.