Company Filing History:
Years Active: 2010-2023
Title: Innovations of Randall S. Parker
Introduction
Randall S. Parker is a notable inventor based in Boise, Idaho, recognized for his contributions to semiconductor technology. With a total of four patents to his name, Parker has made significant advancements in methods related to semiconductor devices.
Latest Patents
One of Parker's latest patents is a method of demounting thin semiconductor devices. This innovative method enables the removal of flexible materials from a temporary carrier for transfer to another surface. Specifically, it addresses the common practice of holding a semiconductor wafer with temporary adhesive during processing steps, including thinning. The method allows for the attachment of the ultra-thin device layer to a roll of tape for removal from the temporary adhesive, facilitating a seamless transfer to a demount roller. This process ensures that the thinned wafer remains in a planar form without the need for laser release processing or chemical adhesive removal. Another significant patent involves semiconductor structures comprising at least one through-substrate via filled with conductive materials. This method selectively removes material from a substrate without damaging the copper filling a via, utilizing an etchant that prevents the formation of copper sulfide.
Career Highlights
Parker has worked with prominent companies in the semiconductor industry, including Micron Technology Incorporated and American Semiconductor Corporation. His experience in these organizations has contributed to his expertise and innovative capabilities in the field.
Collaborations
Throughout his career, Parker has collaborated with talented individuals such as Mark Bossler and Jaspreet Singh Gandhi. These partnerships have likely fostered a creative environment that has led to the development of his patents.
Conclusion
Randall S. Parker's work in semiconductor technology showcases his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving processes and materials in semiconductor manufacturing.