logo

For the Inventor, By the Inventor

Vestal, NY, United States of America

Randall Joseph Stutzman

This inventor holds 26 USPTO granted patents and 1 EPO patent, primarily in Thermal Management. Top assignees: International Business Machines Corporation, Lockheed Martin Corporation. Active years: 1991-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Randall Joseph Stutzman. Retrieved from https://idiyas.com/inventor/randall-joseph-stutzman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26

% Patents Active = 53.8


Average Co-Inventor Count = 3.3

ph-index = 14

Forward Citations = 527(Granted Patents)


Company Filing History:

goldMedal21 out of 166,351 
 
International Business Machines Corporation
 patents
silverMedal5 out of 5,320 
 
Lockheed Martin Corporation
 patents

Years Active: 1991-2021

Loading Chart...
Loading Chart...
Areas of Expertise:
Heat Exchanger
Heat Sink
Thermal Interface
Conduction Cooling
EMI Shielding
Multichip Modules
Chip Packaging
Thermal Management
Printed Circuit Boards
Electronic Assembly
Cooling Assemblies
Cryogenically-Cooled
26 patents (USPTO):Explore Patents
1. 10914535 - Integrated multi-chamber heat exchanger (2021-02-09),
2. 10461018 - Integrated multi-chamber heat exchanger (2019-10-29),
3. 10371462 - Integrated multi-chamber heat exchanger (2019-08-06),
4. 9357670 - Efficient heat transfer from conduction-cooled circuit cards (2016-05-31),
5. 7324336 - Flow through cooling assemblies for conduction-cooled circuit modules (2008-01-29),
6. 7186590 - Thermally enhanced lid for multichip modules (2007-03-06),
7. 6949415 - Module with adhesively attached heat sink (2005-09-27),
8. 6883593 - Heat sink for convection cooling in horizontal applications (2005-04-26),
9. 6830960 - Stress-relieving heatsink structure and method of attachment to an electronic package (2004-12-14),
10. 6829144 - Flip chip package with heat spreader allowing multiple heat sink attachment (2004-12-07),
11. 6793123 - Packaging for multi-processor shared-memory system (2004-09-21),
12. 6744132 - Module with adhesively attached heat sink (2004-06-01),
13. 6740959 - EMI shielding for semiconductor chip carriers (2004-05-25),
14. 6691769 - Heat sink for convection cooling in horizontal applications (2004-02-17),
15. 6675852 - Platen for use in laminating press (2004-01-13),

Title: The Inventor Profile of Randall Joseph Stutzman

Introduction: Randall Joseph Stutzman is a prolific inventor based in Vestal, NY (US) known for his groundbreaking contributions to various industries.

Latest Patents: Randall Joseph Stutzman holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: With a career spanning over two decades, Stutzman has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing unique solutions to address them.

Collaborations: Throughout his career, Randall Joseph Stutzman has collaborated with leading companies, research institutions, and universities to bring his inventions to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Randall Joseph Stutzman's passion for innovation and his relentless pursuit of excellence continue to drive his success as an inventor, making him a prominent figure in the world of patents and inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…