International Business Machines Corporation

Lockheed Martin Corporation

Randall Joseph Stutzman

David James Alcoe

Eric A Johnson

David Luverne Vos

George Henry Thiel

Varaprasad Venkata Calmidi

Michael A Gaynes

Kishor V Desai

Jamil A Wakil

Timothy F Carden

Stephen R Engle

Ryan M Alderfer

Glenn O Dearing

William Louis Brodsky

Harm Peter Hofstee

Sanjeev Balwant Sathe

Thomas W Dalrymple

Donald Seton Farquhar

Jeffrey Allen Zitz

Bruce John Chamberlin

Mario John Interrante

Jerzy Maria Zalesinski

Bahgat Ghaleb Sammakia

Joseph Funari

William Edward Sablinski

Michael Joseph Klodowski

Harvey Charles Hamel

Brenda Lee Peterson

Renee L Weisman

Jeffrey Thomas Coffin

Stephen Wesley MacQuarrie

Mitchell G Ferrill

William Fred Otto

Eugene J Urda

William C Miller

Charles H Dando, Iii

Jon Larcheveque

Don L Baker

Megan J Shannon

Matthew Daniel Miller

Clint Long

Christopher Todd Spring

Russell N Smith

A one-piece heat exchanger manufactured using an additive manufacturing process is described. The heat exchanger includes a plurality of channels formed therein. At least some of the plurality of channels may be configured to provide structural support to the heat exchanger to reduce its weight. Different coolant media may be used in a first set and a second set of the plurality of channels to provide different types of cooling in an integrated one-piece heat exchanger structure.

Integrated multi-chamber heat exchanger

A conduction-cooled card assembly is disclosed that includes a conduction-cooling frame, a printed wiring board mounted on the frame, and a wedgelock fastener. The conduction-cooling frame has a thermal management interface adapted to transfer heat from the frame to a chassis, and the wedgelock fastener is adapted to press the thermal management interface of the conduction-cooling frame against a rail of the chassis. The assembly also has one or more of the following characteristics: (a) the thermal management interface of the conduction-cooling frame is made primarily of a first material and a portion of the thermal management interface that is adapted to engage the wedgelock fastener or the rail of the chassis is made of a second material that is softer than the first material, and (b) the wedgelock fastener is made primarily of a first material and a portion of the wedgelock fastener that is adapted to engage the thermal management interface or another rail of the chassis is made of a second material that is softer than the first material. A chassis for conduction-cooled card assemblies is also disclosed which comprises a housing and at least first and second rails within the housing that are adapted to receive a conduction-cooled card assembly therebetween. At least one of the first and second rails is made primarily of a first material and has a surface portion made of a second material that is softer than the first material.

Efficient heat transfer from conduction-cooled circuit cards

A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.

Flow through cooling assemblies for conduction-cooled circuit modules

An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.

Thermally enhanced lid for multichip modules

A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.

Module with adhesively attached heat sink

A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.

Heat sink for convection cooling in horizontal applications

A stress-relieving heatsink structure and method of forming thereof for an electronic package, for instance, that including a semiconductor chip package which is mounted on a wired carrier, such as a circuitized substrate. The heatsink structure is constituted from a plurality of base structures which are joined along slits so as to impart a degree of flexibility to the electronic package inhibiting the forming of stresses tending to cause delamination of the package components.

Stress-relieving heatsink structure and method of attachment to an electronic package

A chip package is provided with multiple ways of attaching a heat sink directly to the chip carrier. Corner post are mounted to the surface of the chip carrier. A heat spreading plate, with a surface area substantially the same size as the surface area of the chip carrier, is positioned in thermal contact with the surface of a flip chip, for example. The heat spreading plate has corner cuts to accommodate the corner posts of the chip carrier and notches cut into at least two opposing sides. A heat sink plate with holes extending therethrough at each of its four corners is positioned to allow the corner posts of said chip carrier to extend therethrough. Notches cut in two opposing sides of said heat sink plate are aligned with the notches in said heat spreading plate to create slots for a flexible clip to clamp the assembly together. Alternatively, nuts may also be threaded onto the posts to clamp the assembly together.

Flip chip package with heat spreader allowing multiple heat sink attachment

An electrical structure or package, and associated method of formation. A plurality of logic chips is coupled electrically to a memory chip either through conductive members (e.g., solder balls) that interface with the memory chip and each logic chip, or through a sequential logic-to-memory electrically conductive path that includes: a first conductive member electrically coupled to a logic chip; an electrically conductive via path through a circuitized substrate; and a second conductive member electrically coupled to the memory chip. The logic chips are electrically coupled to the substrate either directly through an interfacing solder interconnection from the logic chip to the substrate, or indirectly through the memory chip such that the memory chip is electrically coupled to the substrate by an interfacing solder interconnect. The electrical structure may be plugged into a socket of a backplane of a circuit card.

Packaging for multi-processor shared-memory system

Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

EMI shielding for semiconductor chip carriers

A platen for use in a laminating press is provided which includes a body of material having first and second faces and spaced first and second ends. Preferably, at least one heating device is disposed in the body of material. First and second spaced cooling channels are formed in the body of material, the first cooling channel being adjacent the first face and having a fluid inlet port adjacent to or in the first end, and a fluid outlet port adjacent to or in the second end, and a second cooling channel being adjacent the second face and having a fluid inlet port adjacent to or in said second end, and a fluid outlet port adjacent to or in the first end. The invention also contemplates using such platens for laminating a book or stack of sheets of material to form a unitary single member having reduced stresses.

Platen for use in laminating press

Growing community of inventors

Vestal, NY, United States of America

Randall Joseph Stutzman