The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2008
Filed:
Sep. 27, 2005
David L. Vos, Apalachin, NY (US);
Randall J. Stutzman, Vestal, NY (US);
Jon Larcheveque, Owego, NY (US);
Eugene J. Urda, Binghamton, NY (US);
David L. Vos, Apalachin, NY (US);
Randall J. Stutzman, Vestal, NY (US);
Jon Larcheveque, Owego, NY (US);
Eugene J. Urda, Binghamton, NY (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
A cooling assembly is located in a chassis with a conduction-cooled circuit module and permits the conduction-cooled circuit module to be utilized in an air-flow-through or liquid-flow-through circuit module chassis assembly. The cooling assembly may be a removable cooling adapter or may be integral with the chassis. The cooling assembly includes a housing having a first end and a second end and defining one or more fluid passages. The housing further includes a thermal contact surface to contact the conduction-cooled circuit module. The cooling assembly may be configured for air-flow-through or liquid-flow-through cooling of the conduction-cooled circuit module.