IDiyas

For the Inventor, By the Inventor

Phoenix, AZ, United States of America

Rajen C Dias

USPTO Granted Patents = 12

Average Co-Inventor Count = 1.9

ph-index = 5

Forward Citations = 111(Granted Patents)


Company Filing History:

goldMedal12 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2004-2018

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12 patents (USPTO):Explore Patents
1. 9859248 - Laser die backside film removal for integrated circuit (IC) packaging (2018-01-02),
2. 9412702 - Laser die backside film removal for integrated circuit (IC) packaging (2016-08-09),
3. 7317258 - Thermal interface apparatus, systems, and fabrication methods (2008-01-08),
4. 7314817 - Microelectronic device interconnects (2008-01-01),
5. 7078822 - Microelectronic device interconnects (2006-07-18),
6. 7064014 - Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices (2006-06-20),
7. 7042729 - Thermal interface apparatus, systems, and fabrication methods (2006-05-09),
8. 6955947 - Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices (2005-10-18),
9. 6861285 - Flip chip underfill process (2005-03-01),
10. 6815831 - Flip-chip device with multi-layered underfill having graded coefficient of thermal expansion (2004-11-09),
11. 6812548 - Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices (2004-11-02),
12. 6790709 - Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices (2004-09-14),

Title: Rajen C Dias: Innovator in Integrated Circuit Packaging

Introduction

Rajen C Dias is a prominent inventor based in Phoenix, AZ (US), known for his significant contributions to the field of integrated circuit packaging. With a total of 12 patents to his name, Dias has made remarkable advancements that enhance the efficiency and effectiveness of electronic components.

Latest Patents

One of his latest patents focuses on "Laser die backside film removal for integrated circuit (IC) packaging." This innovation involves die adhesive films that are crucial for IC packaging. The technology allows for the formation and removal of die adhesive films, which can be transparent to one wavelength of light while being photoreactive to another. This dual functionality enables the die surface to be detectable through the adhesive film. The film can be cured or marked using laser energy, and it may include thermochromic dyes or nanoparticles to enhance laser mark contrast. Additionally, UV laser energy is utilized to remove the die adhesive film, exposing underlying features such as TSV pads.

Career Highlights

Rajen C Dias has built a successful career at Intel Corporation, where he has been instrumental in developing innovative solutions for integrated circuits. His work has not only contributed to the advancement of technology but has also positioned him as a key figure in the industry.

Collaborations

Throughout his career, Dias has collaborated with notable colleagues, including Biju Chandran and Yongmei Liu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Rajen C Dias continues to be a driving force in the field of integrated circuit packaging, with his inventions paving the way for future advancements. His dedication to innovation and collaboration exemplifies the spirit of progress in technology.

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