The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2018
Filed:
Jun. 29, 2016
Intel Corporation, Santa Clara, CA (US);
Danish Faruqui, Chandler, AZ (US);
Edward R. Prack, Phoenix, AZ (US);
Sergei L. Voronov, Chandler, AZ (US);
David K. Wilkinson, Jr., Scottsdale, AZ (US);
Tony Dambrauskas, Chandler, AZ (US);
Lars D. Skoglund, Chandler, AZ (US);
Yoshihiro Tomita, Tsukuba, JP;
Mihir A. Oka, Chandler, AZ (US);
Rajen C. Dias, Phoenix, AZ (US);
INTEL CORPORATION, Santa Clara, CA (US);
Abstract
Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or 'inactive' side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.