Raj Kumar

Title: Innovations by Raj Kumar in PCB Assembly Fabrication

Introduction

Raj Kumar is an accomplished inventor based in Anaheim, California. He has made significant contributions to the field of printed circuit board (PCB) assembly fabrication. With a focus on enhancing the efficiency and density of PCB designs, his work has garnered attention in the industry.

Latest Patents

Raj Kumar holds a patent for "Methods for fabricating printed circuit board assemblies with high density via array." This innovative method involves drilling a first plurality of vias with a specific diameter in a PCB and subsequently filling these vias to create plated or filled vias. Additionally, the method includes drilling a second plurality of vias with a different diameter and filling them as well. The unique aspect of this invention is the mixing of the first and second plurality of plated or filled vias, ensuring that the spacing between them is less than their respective diameters. This advancement allows for higher density in PCB assemblies, which is crucial for modern electronic devices.

Career Highlights

Raj Kumar is currently employed at TTM Technologies Inc., a leading company in the PCB manufacturing industry. His expertise in PCB assembly fabrication has positioned him as a valuable asset to the company. Throughout his career, he has demonstrated a commitment to innovation and quality in his work.

Collaborations

Raj has collaborated with notable colleagues, including Michael Len and Chong Mei. Their combined efforts have contributed to the development of advanced PCB technologies and have fostered a collaborative environment that encourages innovation.

Conclusion

In summary, Raj Kumar's contributions to the field of PCB assembly fabrication through his patented methods highlight his role as an influential inventor. His work not only enhances the efficiency of PCB designs but also sets a standard for future innovations in the industry.