This inventor holds 1 USPTO granted patent and 1 published patent application and 2 EPO patents. Top assignee: Ams Ag. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Raimund Hoffmann: Innovator in Resist Structure Production
Introduction
Raimund Hoffmann is a notable inventor based in Soeding, Austria. He has made significant contributions to the field of photolithography, particularly in the production of resist structures. His innovative methods have paved the way for advancements in various applications.
Latest Patents
Hoffmann holds a patent for a method of producing a resist structure with an undercut sidewall. This method involves several steps, including applying a layer of negative photoresist on a bottom layer, providing the layer with a pattern in a border zone, irradiating the surface area according to the desired resist structure, and removing the layer outside the irradiated area. The pattern is designed to have dimensions smaller than the minimal resolution of the irradiation, which may include sub-resolution assist features.
Career Highlights
Throughout his career, Hoffmann has worked with prominent companies such as Ams AG and EV Group GmbH. His experience in these organizations has contributed to his expertise in the field of resist structures and photolithography.
Collaborations
Hoffmann has collaborated with notable colleagues, including Gerhard Eilmsteiner and Johanna Bartel. These partnerships have further enhanced his work and innovation in the industry.
Conclusion
Raimund Hoffmann's contributions to the field of resist structure production demonstrate his innovative spirit and dedication to advancing technology. His patent and collaborations reflect his significant impact on the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
